Innovation and challenges of advanced process and advanced packaging technologies in integrated circuit manufacturing
先进制程和先进封装技术在集成电路制造中的创新与挑战

摘要

先进封装技术在提升电子器件性能与集成度方面具有重要作用，但在推广应用中仍面临多重技术瓶颈。材料适配性不足影响长期稳定性，制造工艺复杂度上升制约量产效率，设计协同机制尚不完善，测试与可靠性评估体系也难以完全匹配发展需求。通过材料创新、工艺优化与智能检测手段的应用，相关难题正在逐步缓解。未来，先进封装将朝向高密度互连、三维异构集成与智能制造方向演进，进一步拓展在高性能计算、人工智能及通信领域的应用空间。

Abstract

Advanced packaging technology plays a crucial role in enhancing the performance and integration level of electronic devices, but its widespread adoption faces multiple technical bottlenecks. Insufficient material compatibility affects long-term stability, while increasing manufacturing process complexity restricts mass production efficiency. The lack of an effective design coordination mechanism and the inadequacy of testing and reliability evaluation systems further hinder development. Through material innovation, process optimization, and the application of intelligent inspection methods, these challenges are being gradually addressed. In the future, advanced packaging will evolve toward high-density interconnection, three-dimensional heterogeneous integration, and smart manufacturing, expanding its application prospects in fields such as high-performance computing, artificial intelligence, and communications.